MUNICH--(BUSINESS WIRE)--onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced a series of new MOSFET devices that feature innovative top-side cooling to assist ...

To meet the needs for high current capability, high efficiency and smaller form factors, Fairchild Semiconductor developed the Dual Cool(tm) packaging for MOSFETs. The Dual Cool package is a top-side ...

Heat dissipation is a critical issue for designers of complex chip-stacking and system-in-package devices. The amount of heat generated by a device increases as the number of transistors goes up, but ...

At APEC 2025, Nexperia announced several important additions to its portfolio of enhancement-mode GaN and SiC devices. Among them is a new series of 1,200-V SIC MOSFETs available in thermally enhanced ...