Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

The rising demands of 5G smartphone, electrical vehicles and data centers drive semiconductor components rapid expansion. The industries increase the investments of advanced packaging technologies to ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...

SINGAPORE--(BUSINESS WIRE)--Capcon, a Singapore-based advanced packaging solution provider, has secured around $50 million in series B2 funding. The fund will mainly be invested in manufacturing, ...