Yahoo Finance

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

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Yahoo Finance

ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating Technology

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Business Wire

Tanaka Precious Metals: Electroplating Engineers of Japan Launched Semiconductor Wafer Cup-type Ultra-compact Plating Laboratory Equipment on July 15, Enabling Plating ...

TOKYO--(BUSINESS WIRE)--Tanaka Holdings Co., Ltd. (Head office: Chiyoda-ku, Tokyo; Representative Director & CEO: Akira Tanae) today announced that Electroplating Engineers of Japan, Limited (Head ...
Nasdaq

ACM Research Strengthens its Fan-Out Panel Level Packaging Portfolio with Launch of Ultra ECP ap-p Tool

FREMONT, Calif., Aug. 07, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...
Business Wire

The New Stratus 200 and Stratus 300 Provides Highest Throughput Electrodeposition System with Maximum Wafer Yield

BILLERICA, Mass.--(BUSINESS WIRE)--July 10, 2006--NEXX Systems, a leading provider of processing equipment for advanced wafer level packaging applications, is pleased to introduce the Stratus 200 and ...
Semiconductor Engineering

Precise Control Needed For Copper Plating And CMP

Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
Business Insider

ClassOne Technology Expands Solstice® Single-Wafer Portfolio with New 300mm Solstice Max Platform for Advanced Packaging Metallization

PHOENIX, Oct. 07, 2025 (GLOBE NEWSWIRE) -- SEMICON WEST -- ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, today ...
New Electronics

ACM Research strengthens FOPLP portfolio with launch of Ultra ECP ap-p Tool

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, has launched the new Panel Electrochemical Plating (Ultra ECP ap-p) tool. This ...
Semiconductor Engineering

Fan-Out Panel-Level Packaging Hurdles

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...
pv magazine International

Copper-plated heterojunction solar cell with 22.1% efficiency, 0.99 bifaciality factor

Built by a Dutch-Chinese research team, the cell is relying on a new type of hybrid-shaped Cu finger consisting of a rectangular bottom part and a round top part, which was integrated into the cell ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...