Fort Collins, Colorado, Jan. 03, 2024 (GLOBE NEWSWIRE) -- The Wafer Level Packaging Market size was valued at USD 7.3 Billion in 2022 and is expected to reach a market size of USD 32.8 Billion by 2032 ...

According to the SNS Insider Report, “The Interposer and Fan-out Wafer Level Packaging Market was valued at USD 32.38 billion in 2023 and is projected to reach USD 88.77 billion by 2032, growing at a ...

(Nanowerk News) Imec engineers have, for the first time, demonstrated the fabrication of extremely small sealed cavities (less than one picoliter in volume), fabricated directly on 200mm silicon ...

Advanced packaging is starting to gain traction as a commercially viable business model rather than just one more possible option, propelled by the technical difficulties in routing signals at 10nm ...

Intel's recent earnings call highlighted a significant challenge affecting their production schedule: the company's wafer-level packaging capabilities are currently insufficient to meet the growing ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Samsung Electronics has stepped up its deployment in the fan-out (FO) wafer-level packaging segment with plans to set up related production lines in Japan, according to industry sources. Samsung has ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its ...