Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...

When Ben Wells, president of Wells R&D (Lincoln, MA), a maker of custom testing solutions for the semiconductor and optical industries, was building a test instrument, he needed to way to stack and ...

With a focus on parallel optimization and nanoscale accuracy, precision positioning specialist PI is streamlining the optical alignment, test and packaging of quantum photonic devices Parallel lines: ...

Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...

NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...