Semiconductor packages used in various vehicle applications require high reliability. As technological innovations in the automotive market increase, the demand for highly reliable packaging is ...
The high performance SG-QFE-7007 socket supports 144-pin, 0.4-mm pitch TQFP packages measuring 16 mm x 16 mm x 1.2 mm with an 18 mm x 18 mm lead tip to tip. The component operates at bandwidths up to ...
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