For all interconnect and joining applications in electronics and hybrid packaging and assembly processes, Indium Corporation offers a complete range of solder preforms that includes their full range ...
Indium Corporation introduces a new, high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component ...
Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...
AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...
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