Glass fiber-reinforced plastic (GFRP), a strong and durable composite material, is widely used in everything from aircraft parts to windmill blades. Yet the very qualities that make it robust enough ...

Engineering silicon carbide (SiC) with tailored morphologies for electronics and structural reinforcement materials has always been a costly and time-consuming affair, but scientists can now do it in ...

Use left and right arrow keys to seek audio. Samsung Electronics has chosen advanced semiconductor packaging and robots for its future growth engines, and will discuss the two next-gen product paths ...

Samsung plans to replace silicon with glass interposers in AI chip manufacturing by 2028. This groundbreaking shift aims to deliver faster, more efficient AI chips, potentially boosting processing ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

A research team led by China’s Sichuan University has investigated methods to tune the content of lead(II) oxide (PbO) and silicon dioxide (SiO₂) within silver paste, with the aim of reducing contact ...

Japan’s Eco Marine Power announced a trial of an integrated solar PV system aboard a bulk cargo ship to demonstrate both practicality and performance. It features glass-free monocrystalline silicon ...

A specialized glass layer could make tomorrow’s computers faster and more energy efficient. Human-made glass is thousands of years old. But it’s now poised to find its way into the AI chips used in ...

Scientists have turned simple glass into a powerful quantum communication device that could safeguard data against future quantum attacks. The chip combines stability, speed, and versatility—handling ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.