The chip industry is conservative when it comes to adopting new metrology and inspection. Will it ultimately see NVD inspection as a wunderkind, or an also-ran? Remember when it first became obvious ...

For a long time, semiconductor defect inspection focused on particles, and particle defects remain an important cause of yield loss. But as devices have become more complex, additional kinds of ...

HEIDENHAIN is a world-leading provider of encoders, machine controls, touch probes, digital readouts and metrology solutions—empowering engineer...READ MORE With 10% of its job openings going unfilled ...

Business competition pressures manufacturers to produce faster, reduce expenses, and increase efficiencies. But all these requirements run into the quality control issue sooner or later — with the ...

MILPITAS, Calif.--(BUSINESS WIRE)--Today KLA-Tencor Corporation (NASDAQ:KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related ...

Borescopic visual inspection may be appropriate for small parts with areas not visible to the naked eye. Even with all the high-tech testing and inspection techniques in use today, basic visual ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

San Francisco, CA. KLA-Tencor today announced two new defect-inspection products, addressing key challenges in tool and process monitoring during silicon wafer and chip manufacturing at the ...

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and ...

Optical surface defect inspection and imaging techniques are pivotal to ensuring high-performance outcomes across a myriad of applications including semiconductor manufacturing, precision optics, and ...

Flip chip microelectronic packaging has emerged as a cornerstone technology in modern semiconductor assembly, wherein the die is mounted upside down to the substrate to facilitate direct ...