SEMICON Japan, Booth E5345 - Rapidus Corporation today announced a new suite of AI design tools to support its Rapidus AI-Assisted Design Solution (Raads), a key initiative to helping to realize its ...

Siemens has introduced Siemens’ electronic design automation software to enhance its power devices and analogue semiconductor ...

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...

Strategic partnerships and global collaboration are required to bring advanced packaging from research to real-world impact.

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

Zuken Inc. (President: Katsube Jinya, hereinafter “Zuken”) has joined “JOINT3” consortium to develop next-generation semiconductor packaging. JOINT3 is a co-creation evaluation framework established ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...

Needham analyst Charles Shi reiterated Taiwan Semiconductor Manufacturing Co (NYSE:TSM) with a Buy and a $225 price target. Taiwan Semiconductor guided 2025 revenue growth to be in the mid-20s percent ...