The critical importance of the trend toward System-on-Chip and System-in-Package is well recognized and is supported on the ITRS roadmap that we have posted in the past. As was pointed out in the last ...

Fujitsu Microelectronics Europe has developed what it believes is the first 64Mbit bare chip memory that is optimized for system-in-a-package (SiP). SiP is a technology that allows a mix of multiple ...

Rambus has taken a new interest in the mobile phone market. The DRAM technology company has acquired a number of patents related to system-in-package (SiP) memory technology aimed specifically at the ...

Taiwanese DRAM maker ProMOS Technologies expects to start volume production of a memory chip using system in package (SIP) technology for high-end handsets in the second half of 2004, according to ...

Hsinchu, Taiwan -- April 8, 2014 — eMemory, an embedded non-volatile memory (eNVM) industry leader announced today its eNVM solutions have been successfully introduced to the electro-medical ...