The latest generation of mobile phone handsets and smart phone/PDAs has replaced the PC as the advanced technology driver for the electronics industry. The sheer volume alone (1.2 billion units ...

IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...

San Jose, Calif.—Fairchild Semiconductor has introduced the FAN7710, a highly integrated ballast IC specifically developed for compact fluorescent lamp (CFL) designs. Offering a system-in-package (SiP ...

The market for system-in-package (SiP) substrates is already tight and will become tighter as Apple is looking to adopt SiP technology in more of its AirPods series, according to sources at ...

Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration, according to ...