In the relentless pursuit of performance and miniaturization, the semiconductor industry has increasingly turned to 3D integrated circuits (3D-ICs) as a cutting-edge solution. Stacking dies in a 3D ...
The chip industry is starting to add technology that can predict impending failures early enough to stave off serious problems, both in manufacturing and in the field. Engineers increasingly are ...
Unified workflow of proven technologies provides high-performance reliability analysis across the product lifecycle compliant with standards such as ISO 26262 Integration with PrimeSim™ Continuum ...
The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...
Failure rate or base failure rate refers to the number of failures per unit of time, typically in terms of failures in time (FITs) equivalent to one failure in a billion hours, which can be expected ...
System engineers are pressured to cut costs and improve the reliability of circuit boards. An often overlooked opportunity to do this is to reduce the number of components used for FPGA, ...
How can systems be designed to guard against unexpected downtime? How does system reliability impact product development? In what ways can artificial intelligence and machine learning improve system ...
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