One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...
HILLSBORO, OR – APRIL 24, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of its low cost, low power MachXO2™ family of programmable logic ...
SCOTTSDALE, USA: Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. Put another way, package selection is increasingly important to ...
UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...
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