This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

QFNs can be a bit intimidating, but they’re here to stay. With a little extra care, you may be able to shrink your board a little and save some of the fabrication costs. QFNs can be a bit intimidating ...

The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

Semiconductor manufacturers have developed innovative production techniques that enable the integration of multiple components and a dc-dc converter IC die into a single module. Producing such a dc-dc ...

Quad Flat No-Lead (QFN) semiconductor packaging provides a small form factor as well as good electrical and thermal performance for low cost. Add demonstrated long term reliability to its benefits and ...

You can achieve a lot with a Dremel. For instance, apparently you can slim the original NES down into the hand-held form-factor. Both the CPU and the PPU (Picture Processing Unit) are 40-pin DIP chips ...