The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

SINGAPORE--12 September 2012, UNITED STATES--(Marketwire - Sep 11, 2012) - STATS ChipPAC Ltd. ("STATS ChipPAC") (SGX-ST:STATSChP), a leading semiconductor test and advanced packaging service provider, ...

The package an IC uses has a very significant effect on layout flexibility and layout can make the difference between a great product, a product with questionable reliability and something that just ...

UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...

Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ...

Rising demand for chips is hitting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, leadframes and even some equipment. Spot shortages for some ...

Advanced packaging of semiconductor chips has emerged as a key enabler in many of today's electronic system products. While much attention with regard to IC packaging is on 3D stacking and integration ...