Why should there be an interest in Package Assembly Design Kits (PADK) today? For the most part, it is due to the advancement in the accumulation of files forming the PADK now offering a customized ...
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AI learns to perform analog layout design
Researchers at Pohang University of Science and Technology (POSTECH) have developed an artificial intelligence approach that ...
SANTA CLARA, Calif., Sept. 5, 2017 /PRNewswire/ -- AnaGlobe Technology, Inc., a leader in layout integration solutions, will announce a unified chip-package layout solution, with features and extended ...
As system-on-chip designs migrate to nanometer silicon, packaging technology is challenged to keep pace with the integration and performance capabilities offered. Nowhere is this more so than in ...
Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...
As the speeds of various SerDes interfaces move into the multi-gigabits/sec range, more ASIC chips are being designed to have multiple high speed interfaces such as USB 3.0, PCIE Gen3, DDR3, and ...
Chips, packages and boards have long been designed in isolation, but as silicon shrinks and complexity grows, the walls are coming down. Rising I/O counts and high-speed interfaces running up to 10 ...
For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...
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