The molding materials used to package lead-free components differ from conventional epoxies in two ways: They take up moisture more slowly, and they better resist higher temperatures. But at the ...

Soldering conditions for individual products depend on factors such as package, printed circuit board, soldering method and the equipment used. This note will provide you a quick overview of the ...

Often it feels as if soldering is deemed to be more of an art form than something that’s underpinned by the cold, hard reality of physics and chemistry. From organic chemistry with rosin, to the ...