Compound Semiconductor

TCL CSOT’s Prima acquisition is part of a wider trend

Chinese appliance firm TCL Technology recently announced that its subsidiary TCL CSOT has successfully acquired an 80 percent ...
Semiconductor Engineering

Optimizing Wafer Edge Processes For Chip Stacking

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...
Electronic Design

True-3D Chip-Layout Editor Facilitates Stacking Of Disparate Wafers

Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 nm. This leads you to ...
Magazine

Cree to produce next-generation LED wafers with new manufacturing capability

Date Announced: 21 Sep 2010 DURHAM, N.C. — Cree, Inc. (Nasdaq: CREE) continues to lead the LED Lighting Revolution with the announcement of a new 150-mm LED wafer production facility in Research ...