Microelectronics has been a hot topic in technology circles in recent years. Although the CHIPS and Science Act is a main driver of the latest resurgence, the defense industrial base’s reliance on ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

In pursuit of more powerful microelectronic systems, more powerful microchips must be packaged closer together, with more robust connections – the same is true for the research partnership to achieve ...

The U.S. Department of Defense (DoD) celebrated a milestone achievement for the State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) Program with the delivery of the first SHIP prototype ...

The field of fluid dispensing and microelectronics packaging is at the forefront of technological innovation, merging precise fluid delivery systems with the intricate assembly of semiconductor ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

While the capabilities of electronic microchips used for cellphones, computers, infrastructure and vehicles have advanced in recent years, researchers say the development of new microelectronic ...

The Department of Commerce is investing up to $300 million to accelerate the development of technologies to boost the semiconductor industry. The department said Thursday the three entities receiving ...

Increasingly, memory chips—in combinations of all their flavors, including DRAM, SRAM, and flash—are at the forefront of microelectronics end-product functions. This scenario is true for cell-phone ...

Advances in semiconductors, materials, power, and more are enabling electronics to miniaturize—including medical electronics. Design News asked Dave Fromm, Promex’s new chief operating officer, a few ...