Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...

KitGuru spent six days with Intel in Phoenix, Arizona learning about their ground-breaking 18A fabrication process which will be used in Panther Lake laptops. It is no secret that Intel has had a ...

On December 3, Intel announced its decision to retain its Networking and Communications unit/NEX following a comprehensive ...

TL;DR: Intel has hired TSMC's former Senior VP Wei-Jen Lo to lead advanced packaging efforts at its Arizona fab, targeting major US tech clients like NVIDIA, Tesla, Microsoft, and Qualcomm. This ...

Intel Corp. has shared new information about Intel 14A, an upcoming chip manufacturing process that will use ASML Holding NV’s most advanced lithography machines. Executives detailed the process today ...

Embedded Multi-die Interconnect Bridge-T (EMIB-T) was a prominent highlight of the Intel Foundry Direct Connect event. Intel is promoting this advanced packaging technology as a key building block for ...

Significantly expanded portfolio of Cadence design IP optimized for Intel's advanced technologies AI-driven digital and analog/custom EDA solutions certified for Intel 18A technology PDK, delivering ...

Cadence today announced a significant expansion of its portfolio of design IP optimized for Intel 18 A and Intel 18 A-P technologies and certification of Cadence ® digital and analog/custom design ...