Speeding time to market, the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC platform, has been certified for UMC’s chip stacking technologies. UMC’s hybrid bonding solutions support the ...
HSINCHU, Taiwan & SAN JOSE, Calif.--(BUSINESS WIRE)--United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc.
Designers charged with creating precision analog front ends and signal chains know that the performance of the voltage reference—whether a discrete standalone device or one that’s embedded in a ...
United Microelectronics (NYSE:UMC) and Cadence Design Systems (NASDAQ:CDNS) collaborate on the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, certified for UMC’s chip stacking ...
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