IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

In 3D packaging, the challenge becomes more severe, as vertically stacked dies can create buried heat sources with limited ...

Display driver IC packaging materials suppliers have recently landed a pull-in of short lead-time orders, which DDI backend firms regard as a short-term phenomenon. Advanced Semiconductor Engineering ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

For AI and HPC processors, performance depends not only on transistor density, but also on memory bandwidth, I/O density, power delivery, thermal management, etc.

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology entered into a 10-year partnership to ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Use left and right arrow keys to seek audio. TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at ...

In a new report from Business Korea, we're hearing that Samsung is making "significant strides" in the semiconductor packaging industry, "positioning itself ahead of TSMC in the Panel Level Packaging ...

Not so long ago, defense and aerospace applications were the traditional drivers of advances in electronic packaging technologies, or "the way electronic systems are assembled." At the time, cost was ...

Asahi Kasei has constructed a new slitting facility for SUNFORT™ dry film photoresist (DFR) at its manufacturing site in Tainan, Taiwan, on July 3.