The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

This paper aims to emphasize on the importance of integrating design for failure analysis in the layout considerations during the IC development process. It will have a brief overview on the ...

In one instance, to further enhance output voltage swing and linearity, the authors propose a novel “breakdown-voltage (BV) ...

Imec has developed a impulse-radio UWM transmitter IC measuring 0.155mm², with a power consumption of less than 10 milliwatt (mW), fabbed in 28nm CMOS. The chip can accommodate data transfer rates of ...

Nearly every big city reaches a point in its evolution when it runs out of open space and starts building vertically. This enables far more apartments, offices and people per square mile, while ...

Can MEMS become a mainstream technology? It certainly seems so now that microelectromechanical systems (MEMS) are being integrated with CMOS processes. As this trend continues grow, electronics ...

Despite increasing costs of development, IC manufacturers are still making great strides. February 21, 2018 -- The success and proliferation of integrated circuits has largely hinged on the ability of ...

Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded ...