Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
- Addresses heat dissipation issues for heat-generating components in vacuum environments - TOKYO--(BUSINESS WIRE)-- OKI Circuit Technology (President: Masaya Suzuki, Head office: Tsuruoka, Yamagata ...
- Addresses heat dissipation issues for heat-generating components in vacuum environments - Rigid-flex PCBs have a structure that combines a thin, light, soft, and durable flexible circuit board (FPC, ...
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