The needs of high-performance devices for artificial intelligence (AI), high performance computing (HPC) and data center applications have drastically accelerated during the Covid-19 pandemic period.
As IC packaging trends toward high density and multiple layers, IC substrates that use Ajinomoto Build-up Film (ABF) as an insulation material (also called ABF substrates) are gaining market attention ...
Taiwanese firm ZD Tech is a leader in IC substrate and Substrate-Like Printed Circuit Boards (SLP), the kind of position American microelectronics makers can only envy. The global semiconductor ...
Researchers develop ultra-fine 3D printing tech for vertical nanolasers, enabling high-density optical chips for AI, AR ...
New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...
AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...
ASE has developed a 70×78-mm Fan-Out Chip on Substrate Bridge (FOCoS-Bridge) package that packs two ASICs and eight high-bandwidth memory devices connected via eight silicon bridges. The large package ...
Optical Components are manufactured from a wide range of substrates, and the very materials they're fabricated from dictate their suitability for specific tasks. Here, Knight Optical – the leading ...
Chiplets and advanced packaging have been on the cutting-edge of electronic technology for a while, but Intel is changing where it might be headed. Today’s organic substrates, like Ajinomoto build-up ...
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