In the modern electronics industry, devices are becoming smaller, faster, and more sophisticated than ever before. To meet ...
As the latest additions to the Molex Mini-Fit® product line, our new high-current, high-density connectors are ideal for telecom, medical, industrial, computer and power supply applications.The ...
A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding” was published by researchers at Aalto University in Finland. “The trend ...
Artificial intelligence (AI) is driving an unprecedented surge in demand for compute and memory performance, driven by applications like ChatGPT based on large language models (LLMs). This requires ...
SAN FRANCISCO--(BUSINESS WIRE)--Avicena, headquartered in Sunnyvale, CA, is announcing its new scalable LightBundle™ interconnect platform at OFC 2025 in San ...
Designed for high-density applications, the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect system delivers 25-Gb/s data rates and support next-generation 100-Gb/s Ethernet and 100-Gb/s ...
Much has been written in the past few months about the upcoming sunset of Moore’s Law. Stated succinctly, Gordon Moore predicted in 1965 that the number of transistors in ICs would double every 12 ...
(MENAFN- EIN Presswire) EINPresswire/ -- "How Much Is The Ultra-Short Reach Optical Interconnect Market Worth? The market size for ultra-short reach optical interconnect has witnessed swift expansion ...
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