The Xpedition Path Finder suite provides a single environment that gives cross-domain design teams the ability to model every device/interface to the level of detail and accuracy they require. IC ...

Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...

Another common challenge is the time required for verification signoff prior to manufacture. The proven way to avoid this bottleneck and its related impacts is to implement a process and methodology ...

Sales of Taiwan-based IC packaging and testing companies and IC substrate makers are expected to receive a boost for second-quarter performance, driven by improving orders for graphics IC applications ...