Failure analysis of ICs requires a quick and proper response because, of course, helping a customer is our main concern. But should we expect the quality assurance (QA) department to test every ...

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor packaging through its growing expertise in failure analysis (FA) technology.

When a chip malfunctions it’s the job of the failure analysis engineer to determine how it failed or significantly deviated from its key performance metrics. The cost of failure in the field can be ...