3D-IC technology complements conventional transistor scaling to enable designers to achieve higher levels of integration by allowing multiple die to be stacked vertically, or in a side-by-side “2.5D” ...
Gaps in EDA tool chains for 2.5D designs are limiting the adoption of this advanced packaging approach, which so far has been largely confined to high-performance computing. But as the rest of the ...
GLOBALFOUNDRIES Introduces Certified Design Flows for Multi-Die Integration Using 2.5D IC Technology
MILPITAS, Calif.--(BUSINESS WIRE)--At next week’s 50th Design Automation Conference (DAC) in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support 2.5D IC ...
The design and analysis of an SoC based on an interposer is not for the faint of heart today, but the industry is aware of the challenges and is attempting to solve them. Until that happens, however, ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results