SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, has introduced new chip-on-board (COB) LED package lineups, including small LES ...
Samsung Electronics introduced a full line-up of chip-scale LED packages (CSP), including 0.6-W-class and 3-W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages. Samsung’s CSP technology ...
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