The PHY2060 advanced serial retiming receiver provides a Ethernet data rate of 10.3125 Gbits/s, on rack-to-rack copper interconnects of up to 30 m. The IC comes in a small 5 x 5-mm flip-chip BGA36 ...
Marvell's $3.8B acquisitions of Celestial AI and XConn target optical interconnects and CXL switching for next-gen AI ...
Applied Materials rolled out a semiconductor fab tool this month that gives its a new way to engineer copper interconnects in advanced logic chips, solving a stumbling block to future 3-nanometer ...
SANTA CLARA, Calif. — During the 2004 Symposium on VLSI Technology in Honolulu, Intel Corp. is expected to unveil a technology that could push out the need for chip-to-chip optical interconnects to at ...
Ayar Labs Inc., a startup developing a new way of linking together chips in data centers, today announced that it has raised $25 million from investors. The funding was provided as an extension to a ...
tom's Hardware on MSN
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip packaging, and interconnects at IEDM 2024
Today, the Intel Foundry Technology Research team announced technology breakthroughs in 2D transistor technology using beyond ...
The industry's first 90-nm test chip for X Architecture interconnect designs has been produced by Applied Materials (AMAT) at its Maydan Technology Center in Sunnyvale, Calif. The fabricated chip ...
New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with ...
The first wave of chips is hitting the market using a technology called hybrid bonding, setting the stage for a new and competitive era of 3D-based chip products and advanced packages. AMD is the ...
First memory chips. Then lasers. Now, copper looks to be the next commodity to pose ‘systemic risk’ to the digital ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback