New vertical device architecture promises stable, ultra-dense semiconductor stacking for future AI and high-performance ...

Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the plumbing that feeds them data. A new generation of 3D chips, built by stacking ...

Researchers developed a dual-modulated vertically stacked transistor that eliminates current leakage at nanoscale channel lengths, advancing low-power 3D chip integration.

Researchers developed a dual-modulated vertical transistor that suppresses leakage at nanoscale channels and supports ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

MediaTek unveiled the Dimensity 9400 chip in October 2024. Speculations are rife that the Taiwanese chipmaker is now working on the Dimensity 9500, which may debut in the last quarter of this year. A ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

China has introduced a domestically engineered AI chip it claims can match or exceed the performance of NVIDIA’s advanced 4nm GPUs. The announcement, made at the ICC Global CEO Summit in Beijing, ...